翻訳と辞書 Words near each other ・ IEEE Biomedical Engineering Award ・ IEEE Biometrics Council ・ IEEE Broadcast Technology Society ・ IEEE C2 ・ IEEE Centennial Medal ・ IEEE Charles Proteus Steinmetz Award ・ IEEE Circuits and Systems Society ・ IEEE Cledo Brunetti Award ・ IEEE Cloud Computing ・ IEEE Committee on Earth Observation ・ IEEE Communications Letters ・ IEEE Communications Magazine ・ IEEE Communications Society ・ IEEE Communications Surveys and Tutorials ・ IEEE Components, Packaging & Manufacturing Technology Society ・ IEEE Components, Packaging, and Manufacturing Technologies Award ・ IEEE Computational Intelligence Society ・ IEEE Computer Society ・ IEEE COMSATS Institute of Information Technology Abbottabad ・ IEEE conferences ・ IEEE Congress on Evolutionary Computation ・ IEEE Consumer Electronics Society ・ IEEE Control Systems Award ・ IEEE Control Systems Society ・ IEEE Corporate Innovation Recognition ・ IEEE Council on Electronic Design Automation ・ IEEE Council on Superconductivity ・ IEEE Daniel E. Noble Award ・ IEEE David Sarnoff Award ・ IEEE Dennis J. Picard Medal for Radar Technologies and Applications Dictionary Lists mini英和辞書 mini和英辞書 Webster 1913 Latin-English FOLDOC Wikipedia English ウィキペディア

翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク IEEE Components, Packaging, and Manufacturing Technologies Award ： ウィキペディア英語版 IEEE Components, Packaging, and Manufacturing Technologies Award The IEEE Components, Packaging, and Manufacturing Technologies Award is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies. The award may be presented to an individual or a team of up to three recipients. Recipients of this award receive a bronze medal, certificate and an honorarium. == Recipients == Recipients of the award for each year include: * 2015: Nasser Borozorg-Grayeli * 2014: Avram Bar-Cohen * 2013: John Lau * 2012: Mauro Walker 〔(Mauro J. Walker, Driver of Microelectronics Production Advancements, to Receive 2012 IEEE Components, Packaging and Manufacturing Technology Award ), IEEE Press release 〕 * 2011: Rao R. Tummala〔(Rao Tummala to Receive IEEE CPMT Award ), Georgia Inst. Technology, July 23, 2010.〕〔(Rao R. Tummala, Microelectronics Packaging Trailblazer, to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award ), TMCnet.com, May 19, 2011.〕 * 2010: Herbert Reichl〔(IEEE Components, Packaging & Manufacturing Technology Award 2010 ), Fraunhofer IZM, July 2009.〕〔(Herbert Reichl awarded IEEE CPMT field award for 2010 ), ElectroIQ, June 10, 2010.〕 * 2009: 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「IEEE Components, Packaging, and Manufacturing Technologies Award」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.